4,4'-Diamino-3,3'-dimethyldiphenylmethane is used as an H-grade insulation material, polyurethane adhesive, epoxy resin curing agent, etc.
4,4'-Diamino-3,3'-dimethyldiphenylmethane
Synonyms: 4,4'-Methylenebis(2-methylaniline)
Molecular Formula: C15H18N2
Molecular Weight: 226.32
CAS: 838-88-0
EC: 212-658-8
Melting point: 155-157 ° C
Boiling point: 357.94 ° C
White to light yellow to light orange
4,4'-Diamino-3,3'-dimethyldiphenylmethane is used as an H-grade insulation material, polyurethane adhesive, epoxy resin curing agent, etc.